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Ftechiz Solutions Pvt Ltd

Platforms

Silicon we bring up, devices we ship

We work across the major Android and embedded Linux silicon vendors — and, more often than not, on boards that no longer look much like the reference design.

SoCarm64LPDDReMMCPMICWiFi/BTXTALUSB-CHDMIRJ45GPIO / I2C / SPI / UARTMIPI CSI / DSIUART DEBUGFTECHIZ EVK · REV B

Silicon vendors

Where the BSP comes from

Each vendor has its own release cadence, its own kernel fork and its own set of sharp edges. Familiarity with those saves months.

Qualcomm

Snapdragon mobile, QCS / QCM IoT, SA automotive

Vendor BSP integration, CRD-to-custom-board porting, and the Qualcomm release cadence.

MediaTek

Genio IoT, Dimensity, MT8xxx

Genio platform bring-up and MediaTek BSP customisation for non-reference hardware.

NXP

i.MX 8, i.MX 8M Plus, i.MX 93 / 95

Android and Yocto on i.MX, including the vendor kernel and NPU enablement.

Rockchip

RK3588 / RK3576 / RK3568

Popular for signage, HMI and edge AI. Strong price-to-performance, rough vendor trees.

Texas Instruments

AM62, AM62A, Sitara, Jacinto

Industrial and automotive targets, frequently paired with real-time cores.

Amlogic

S9xx series

Android TV and set-top box platforms, including Google TV requirements.

Renesas

R-Car series

Automotive cockpit and gateway programmes with functional safety expectations.

NVIDIA

Jetson Orin, Tegra

Edge AI and robotics targets where the GPU stack is the point.

Samsung

Exynos

Mobile and wearable platforms on the Exynos vendor stack.

Allwinner

A-series, T-series

Cost-sensitive consumer and industrial devices.

Intel

x86 Android, Celadon

x86 Android targets for kiosk, retail and virtualised deployments.

Broadcom

Connectivity and STB SoCs

Wi-Fi and Bluetooth module integration across many of the platforms above.

Working on something not listed? The bring-up process is the same — ask us.

Device classes

What we build them into

The stack changes shape depending on what the device has to do. These are the categories we see most.

IVI HEAD UNITRUGGED HANDHELDANDROID TV / STBINDUSTRIAL HMIEDGE AI CAMERA

Automotive

IVI head units, instrument clusters, rear-seat entertainment and telematics gateways, where boot deadlines and vehicle bus integration drive the architecture.

IVI head unitDigital clusterTelematics unitRear-seat display

Industrial & medical

Rugged handhelds, HMIs and instrument controllers that need long support windows, deterministic behaviour and a documented security posture.

Rugged handheldMachine HMIDiagnostic instrumentControl panel

Retail & payments

Point-of-sale terminals, payment devices and self-service kiosks where the platform must be locked down and certifiable.

POS terminalPayment deviceSelf-service kioskDigital signage

Consumer & media

Set-top boxes, streaming devices, tablets and smart displays, typically with GMS or Google TV certification in scope.

Android TV boxSmart displayTabletStreaming stick

Robotics & edge AI

Platforms where camera pipelines, accelerators and real-time control matter more than the application framework.

Service robotDrone payloadEdge AI gatewaySmart camera

Connectivity & IoT

Gateways and headless devices, often on embedded Linux rather than Android, with fleet update requirements from day one.

IoT gatewayRouter / CPESensor hubAsset tracker

Reality check

Three things about vendor BSPs

Reference board to custom board

Vendor BSPs are written for the vendor's evaluation kit. The moment your schematic diverges — a different PMIC, a new panel, a relocated bus — the reference tree stops being correct. Closing that gap is the work.

Vendor trees are a starting point

Vendor kernels carry out-of-tree patches, stale forks and code that never expected your peripheral set. We keep what is useful, rebase what is not, and document what we carried and why.

Upgradability is a design decision

Whether a board can take the next Android release is decided during bring-up, in how cleanly the vendor interface is separated. We build for the upgrade you have not scheduled yet.